Engineering Service
Assembly Service
->Design center
->Assembly Capability
．Frontend
．Backend
->Thick Film Package
->RA & FA
Testing Service
->Test Overview
->Test Capability
 
Substrate Design
  • ShunSin has business with several famous PCB suppliers locating in Taiwan, China, Japan and Korea. Shunsin can provide the packaging and testing service for laminates, thin PCB without core, soft PCB and LTCC board.
  • A professional team helps to design the print circuit board.
If you need Shunsin to design the PCB, please provide the following information.
  • Needed Design information
    • Specification for the Product
      • Input / Output Port Definition Description
      • Dimension
      • Usage
    • Schematic and Network list
    • Appearance Drawing in format of Autocad
  • Design output
    • Gerber File for PCB
    • Design Rule for PCB and Material
  • Design Lead-time
    • 10 Days for One Module
設計
Design Process



Thermal Stress Simulation
  • Thermal stress is critical to SIP packages, especially for RF application. Improper package designs will lead to package failures after assembly or reliability tests. Shunsin provides thermal stress simulation service for customers to prevent potential thermal issues during package design phase.
熱應力模擬分析
Address:No.9 Jianye East Road, Torch Hi-tech Development Zone, Zhongshan, Guangdong Province,China. TEL:+86-760-23381357 FAX:+86-760-23382117
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